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| d a t a sh eet product speci?cation supersedes data of 1997 oct 21 file under integrated circuits, ic18 2000 jan 13 integrated circuits pca82c250 can controller interface
2000 jan 13 2 philips semiconductors product speci?cation can controller interface pca82c250 features fully compatible with the iso 11898 standard high speed (up to 1 mbaud) bus lines protected against transients in an automotive environment slope control to reduce radio frequency interference (rfi) differential receiver with wide common-mode range for high immunity against electromagnetic interference (emi) thermally protected short-circuit proof to battery and ground low-current standby mode an unpowered node does not disturb the bus lines at least 110 nodes can be connected. applications high-speed applications (up to 1 mbaud) in cars. general description the pca82c250 is the interface between the can protocol controller and the physical bus. the device provides differential transmit capability to the bus and differential receive capability to the can controller. quick reference data ordering information symbol parameter conditions min. max. unit v cc supply voltage 4.5 5.5 v i cc supply current standby mode - 170 m a 1/t bit maximum transmission speed non-return-to-zero 1 - mbaud v can canh, canl input/output voltage - 8 +18 v v diff differential bus voltage 1.5 3.0 v t pd propagation delay high-speed mode - 50 ns t amb ambient temperature - 40 +125 c type number package name description code pca82c250 dip8 plastic dual in-line package; 8 leads (300 mil) sot97-1 pca82c250t so8 plastic small outline package; 8 leads; body width 3.9 mm sot96-1 pca82c250u - bare die; 2790 1780 380 m m - 2000 jan 13 3 philips semiconductors product speci?cation can controller interface pca82c250 block diagram handbook, full pagewidth mka669 receiver hs reference voltage slope/ standby protection driver 3 2 5 4 8 1 6 7 gnd canl canh v ref txd rs rxd v cc pca82c250 fig.1 block diagram. pinning symbol pin description txd 1 transmit data input gnd 2 ground v cc 3 supply voltage rxd 4 receive data output v ref 5 reference voltage output canl 6 low-level can voltage input/output canh 7 high-level can voltage input/output rs 8 slope resistor input handbook, halfpage 1 2 3 4 8 7 6 5 mka670 pca82c250 rs canh gnd canl v ref rxd v cc txd fig.2 pin configuration. 2000 jan 13 4 philips semiconductors product speci?cation can controller interface pca82c250 functional description the pca82c250 is the interface between the can protocol controller and the physical bus. it is primarily intended for high-speed applications (up to 1 mbaud) in cars. the device provides differential transmit capability to the bus and differential receive capability to the can controller. it is fully compatible with the iso 11898 standard. a current limiting circuit protects the transmitter output stage against short-circuit to positive and negative battery voltage. although the power dissipation is increased during this fault condition, this feature will prevent destruction of the transmitter output stage. if the junction temperature exceeds a value of approximately 160 c, the limiting current of both transmitter outputs is decreased. because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and hence a lower chip temperature. all other parts of the ic will remain in operation. the thermal protection is particularly needed when a bus line is short-circuited. the canh and canl lines are also protected against electrical transients which may occur in an automotive environment. pin 8 (rs) allows three different modes of operation to be selected: high-speed, slope control or standby. for high-speed operation, the transmitter output transistors are simply switched on and off as fast as possible. in this mode, no measures are taken to limit the rise and fall slope. use of a shielded cable is recommended to avoid rfi problems. the high-speed mode is selected by connecting pin 8 to ground. for lower speeds or shorter bus length, an unshielded twisted pair or a parallel pair of wires can be used for the bus. to reduce rfi, the rise and fall slope should be limited. the rise and fall slope can be programmed with a resistor connected from pin 8 to ground. the slope is proportional to the current output at pin 8. if a high level is applied to pin 8, the circuit enters a low current standby mode. in this mode, the transmitter is switched off and the receiver is switched to a low current. if dominant bits are detected (differential bus voltage >0.9 v), rxd will be switched to a low level. the microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). because the receiver is slow in standby mode, the first message will be lost. table 1 truth table of the can transceiver note 1. x = dont care. table 2 pin rs summary supply txd canh canl bus state rxd 4.5 to 5.5 v 0 high low dominant 0 4.5 to 5.5 v 1 (or ?oating) ?oating ?oating recessive 1 <2 v (not powered) x (1) ?oating ?oating recessive x (1) 2v 2000 jan 13 6 philips semiconductors product speci?cation can controller interface pca82c250 characteristics v cc = 4.5 to 5.5 v; t amb = - 40 to +125 c; r l =60 w ; i 8 > - 10 m a; unless otherwise speci?ed; all voltages referenced to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100% tested at +25 c. symbol parameter conditions min. typ. max. unit supply i 3 supply current dominant; v 1 =1v -- 70 ma recessive; v 1 =4v; r 8 =47k w -- 14 ma recessive; v 1 =4v; v 8 =1v -- 18 ma standby; t amb <90 c; note 1 - 100 170 m a dc bus transmitter v ih high-level input voltage output recessive 0.7v cc - v cc + 0.3 v v il low-level input voltage output dominant - 0.3 - 0.3v cc v i ih high-level input current v 1 =4v - 200 - +30 m a i il low-level input current v 1 =1v - 100 -- 600 m a v 6,7 recessive bus voltage v 1 = 4 v; no load 2.0 - 3.0 v i lo off-state output leakage current - 2v<(v 6, v 7 )<7v - 2 - +1 ma - 5v<(v 6, v 7 )<18v - 5 - +12 ma v 7 canh output voltage v 1 = 1 v 2.75 - 4.5 v v 6 canl output voltage v 1 = 1 v 0.5 - 2.25 v d v 6, 7 difference between output voltage at pins 6 and 7 v 1 = 1 v 1.5 - 3.0 v v 1 =1v; r l =45 w ; v cc 3 4.9 v 1.5 -- v v 1 = 4 v; no load - 500 - +50 mv i sc7 short-circuit canh current v 7 = - 5 v; v cc 5v --- 105 ma v 7 = - 5 v; v cc = 5.5 v --- 120 ma i sc6 short-circuit canl current v 6 =18v -- 160 ma dc bus receiver: v 1 = 4 v; pins 6 and 7 externally driven; - 2v<(v 6, v 7 ) < 7 v; unless otherwise speci?ed v diff(r) differential input voltage (recessive) - 1.0 - +0.5 v - 7v<(v 6, v 7 )<12v; not standby mode - 1.0 - +0.4 v v diff(d) differential input voltage (dominant) 0.9 - 5.0 v - 7v<(v 6, v 7 )<12v; not standby mode 1.0 - 5.0 v v diff(hys) differential input hysteresis see fig.5 - 150 - mv v oh high-level output voltage (pin 4) i 4 = - 100 m a 0.8v cc - v cc v v ol low-level output voltage (pin 4) i 4 =1ma 0 - 0.2v cc v i 4 =10ma 0 - 1.5 v r i canh, canl input resistance 5 - 25 k w 2000 jan 13 7 philips semiconductors product speci?cation can controller interface pca82c250 note 1. i 1 =i 4 =i 5 = 0 ma; 0 v < v 6 2000 jan 13 9 philips semiconductors product speci?cation can controller interface pca82c250 handbook, full pagewidth mka673 hysteresis v rxd high low 0.5 v 0.9 v v diff fig.5 hysteresis. handbook, full pagewidth mka674 t wake v rs v rxd v cc 0 v fig.6 timing diagram for wake-up from standby. v 1 =1v. 2000 jan 13 10 philips semiconductors product speci?cation can controller interface pca82c250 handbook, full pagewidth mka675 t drxdl 1.5 v 0 v v diff v rxd fig.7 timing diagram for bus dominant to rxd low. v 1 = 4 v; v 8 =4v. handbook, full pagewidth mka676 pca82c250 rxd v ref txd canh canl gnd v cc schaffner generator 62 w + 5 v r ext rs 1 nf 1 nf fig.8 test circuit for automotive transients. the waveforms of the applied transients shall be in accordance with iso 7637 part 1 , test pulses 1, 2, 3a and 3b. 2000 jan 13 11 philips semiconductors product speci?cation can controller interface pca82c250 application information handbook, halfpage mka677 p8xc592/p8xce598 can-controller pca82c250t can-transceiver ctx0 crx0 crx1 px,y txd rxd v ref canl can bus line canh rs r ext + 5 v 100 nf 124 w 124 w v cc gnd fig.9 application of the can transceiver. 2000 jan 13 12 philips semiconductors product speci?cation can controller interface pca82c250 handbook, full pagewidth v dd v ss r ext + 5 v + 5 v + 5 v 0 v 100 nf 100 nf 390 w 390 w 390 w 6.8 k w 3.6 k w 390 w 6n137 6n137 mka678 pca82c250 can-transceiver txd rxd v ref canl can bus line canh rs + 5 v 100 nf 124 w 124 w v cc gnd sja1000 can-controller tx0 tx1 rx0 rx1 fig.10 application with galvanic isolation. 2000 jan 13 13 philips semiconductors product speci?cation can controller interface pca82c250 internal pin configuration handbook, full pagewidth mka679 7 6 2 5 4 8 1 3 txd v cc rs rxd v ref gnd canh canl pca82c250 fig.11 internal pin configuration. 2000 jan 13 14 philips semiconductors product speci?cation can controller interface pca82c250 bonding pad locations note 1. all coordinates ( m m) represent the position of the centre of each pad with respect to the bottom left-hand corner of the die (x/y = 0). symbol pad coordinates (1) xy txd 1 196 135 gnd 2 1280 135 v cc 3 1767 135 rxd 4 2588 135 v ref 5 2594 1640 canl 6 1689 1640 canh 7 948 1640 rs 8 196 1640 handbook, full pagewidth pca82c250u 1 txd 8 rs 7 canh 6 canl 5 v ref v cc 2 gnd 34 rxd mgl945 y 2.79 mm x 0 0 1.78 mm fig.12 bonding pad locations. 2000 jan 13 15 philips semiconductors product speci?cation can controller interface pca82c250 package outlines references outline version european projection issue date iec jedec eiaj sot97-1 95-02-04 99-12-27 unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 1.15 4.2 0.51 3.2 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.045 0.17 0.020 0.13 b 2 050g01 mo-001 sc-504-8 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 8 1 5 4 b e 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. pin 1 index dip8: plastic dual in-line package; 8 leads (300 mil) sot97-1 2000 jan 13 16 philips semiconductors product speci?cation can controller interface pca82c250 unit a max. a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 0.25 dimensions (inch dimensions are derived from the original mm dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 1.0 0.4 sot96-1 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 4 5 pin 1 index 1 8 y 076e03 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.050 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.01 0.041 0.004 0.039 0.016 0 2.5 5 mm scale so8: plastic small outline package; 8 leads; body width 3.9 mm sot96-1 97-05-22 99-12-27 2000 jan 13 17 philips semiconductors product speci?cation can controller interface pca82c250 soldering introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. through-hole mount packages s oldering by dipping or by solder wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joints for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. surface mount packages r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 2000 jan 13 18 philips semiconductors product speci?cation can controller interface pca82c250 suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 5. wave soldering is only suitable for lqfp, qfp and tqfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. mounting package soldering method wave reflow (1) dipping through-hole mount dbs, dip, hdip, sdip, sil suitable (2) - suitable surface mount bga, lfbga, sqfp, tfbga not suitable suitable - hbcc, hlqfp, hsqfp, hsop, htqfp, htssop, sms not suitable (3) suitable - plcc (4) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (4)(5) suitable - ssop, tssop, vso not recommended (6) suitable - 2000 jan 13 19 philips semiconductors product speci?cation can controller interface pca82c250 definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. bare die disclaimer all die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of philips delivery. if there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. there are no post packing tests performed on individual die or wafer. philips semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. accordingly, philips semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. it is the responsibility of the customer to test and qualify their application in which the die is used. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. ? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 2000 69 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 3341 299, fax.+381 11 3342 553 printed in the netherlands 285002/05/pp 20 date of release: 2000 jan 13 document order number: 9397 750 06609 |
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